| Model |
SYP09 |
Material
|
Polyimide Film |
Adhesive
|
Silicone |
| Total Thickness (mm) |
0.06 |
| Adhesion (g/mm2) |
5 |
| Tensile Strength (N/25mm) |
115 |
| Elongation (%) |
50 |
| Temperature Resistance |
200℃ / 60 minutes
260℃ / 1 minutes
Insulation Grade: H |
Features
|
Good performance in adhesive force, high temperature resistance, solvent resistance, strong holding force, no residual Adhesive left. |
| Application |
Used to protect gold fingers when PCB being tin sprayed as well as ware-soldering
| |
