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型号
Model |
SYP09 |
基材
Material |
聚酰亚胺薄膜 / Polyimide Film |
胶粘剂
Adhesive |
硅酮 / Silicone |
总厚度
Total Thickness (mm) |
0.06 |
粘着力
Adhesion (g/mm2) |
5 |
抗拉力
Tensile Strength (N/25mm) |
115 |
伸长率
Elongation (%) |
50 |
耐热性
Temperature Resistance |
200℃ / 60分钟 / 200℃ / 60 min, or
260℃ /
1分钟 / 260℃ / 1 min
绝缘等级H级 / Insulation
Grade: H |
特性
Features |
粘性佳、耐高温、耐溶剂、保持力强、不残胶。
Good performance in
adhesive force, high temperature resistance,
solvent resistance, strong holding force, no
residual Adhesive left. |
用途
Application |
用于印刷线路板（PCB）过锡炉喷锡和波峰过程中遮蔽保护金手指。
Used to
protect gold fingers when PCB being tin sprayed
as well as
ware-soldering. | |
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